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You are searching the holdings of more than 100 academic libraries: more information
12 Hits
1.
Electronic Article

Polycyclic siloxanes: Base resins for novel high temperature resistant platinum curing transparent silicone adhesives

for International Journal of Adhesion and Adhesives | Vol. 82 (2018), p. 254-262
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2.
Article

Prediction of modulus evolution of a silicone composite using DMA for cure kinetic profile development

for NATAS, North American Thermal Analysis Society Conference, 43 | (2015), p. 291-305
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3.
Article

Development of a High Temperature Interconnect Solution as an Alternative to High Lead or Gold Content Solders

for HiTEC, IMAPS International Conference and Exhibition on High Temperature Electronics, 2016 | (2016), p. 207-217
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4.
Electronic Article

Integrated carbon nanotube array as dry adhesive for high-temperature silicon processing

for Advanced Materials, Weinheim | Vol. 23, No. 37 (2011), p. 4285-4289
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5.
Electronic Article

Optical characterization of RTV615 silicone rubber compound

for Journal of Instrumentation (Online) | Vol. 9, No. 7 (2014), p. P07012/1-12
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6.
Electronic Article

Use of master curves based on time-temperature superposition to predict creep failure of aluminium-glass adhesive joints

for International Journal of Adhesion and Adhesives | Vol. 74 (2017), p. 144-154
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7.
Electronic Article

Silicon strain gages bonded on stainless steel using glass frit for strain sensor applications

for Measurement Science and Technology | Vol. 25, No. 5 (2014), p. 055102/1-7
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8.
Electronic Article

Fabrication and Test of High-Temperature Ceramic Transformer

for Solid State Phenomena | Vol. 216 (2014), p. 233-238
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9.
Electronic Article

Effect of PSO and TiB2 content on the high temperature adhesion strength of SiBCNO ceramic

for Ceramics International | Vol. 45, No. 7, PB (2019), p. 9515-9521
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10.
Electronic Article

Preparation and performance of ceramizable heat-resistant organic adhesive for joining Al2O3 ceramics

for International Journal of Adhesion and Adhesives | Vol. 55 (2014), p. 132-138
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